ICMAN 2009 Organization

Honorary Chairman

Prof. Jiaming Li, Tsinghua University, China
Prof. Guofan Jin, Tsinghua University, China

Organizing Committee

Chair
Jinshan Wang, President, Chongqing Jinshan Science & Technology(Group) Co.,ltd

Co-chairs
Mr. Xu Zhou, Director, Chongqing Science&Technology Commission, China
Prof. Zhiyu Wen, Chongqing University, China
Mr. Shiliu Xu, Director, The 24th Institute of CETC, China
Prof. Yike Tang, President, CQUST, China
Prof. Lining Sun, HIT, China
Prof. Yilong Hao, Peking University, China

Committee Members
Ms. Xiaorui Chen, Chongqing Science&Technology Commission, China
Prof. Xinxin Li, SIMIT-CAS, China
Dr. Teng Gao, IMEC, Belgium
Prof. Ying Wu, CQUST, China
Dr. Zhaotao Gong, Chongqing Jinshan Science & Technology(Group) Co.,ltd, China
Mr. Lin Yang, Russia-China economic trade cooperation center
Dr. Yanying Feng, Tsinghua University, China
Dr. Wei Zhang, First MEMS Co., Ltd, China
Prof. Ming Liu, MECCAS, China
Prof. Jianling Ding, Jiangsu University, China
Dr. Li Feng, SEMI China, USA
Prof. Zhonghan Xiao, CIS, China
Prof. Sheng Liu, Huazhong University of Science & Technology(HUST), China
Dr. Linrui Guo, Institute of Automatic Control Equipment, China
Ms. Hong Wang, Director, International Innovation Park of Micro & Nano Technology, China
Mr. Xiaoming Wen, President, Xi’an Precision optical Instrument Co., Ltd, China

International Committee

Chair
Prof. Zhaoying Zhou, Tsinghua University, China

Co-chairs
Prof. Masayoshi Esashi, Tohoku University, Japan
Prof. Thomas Gessner, Fraunhofer Inst. (IZM), Germany
Prof. Paolo Dario, University of Pisa, Italy
Prof. Norman Tien, CWRU, USA
Prof. Weizheng Yuan, Northwestern Polytechnical University, China
Prof. Yilong Hao, Peking University, Chin
Dr. Hui Xu Muller, Compass Star Company, France
Prof. Haixia Zhang, Peking University, China
Dr. Cheng Yan, Queensland University of Technology,Australia
Ms. Yuguang Li, Assistant Counsel , Chongqing Science&Technology Commission, China
Prof. Xincai Zhu, Vice President, CQUST, China

Committee Members
Dr. Suanne Hackett, Invest Australia Canberra office, Australia
Mr. Fujiang Wang, Chongqing Science & Technology Commission, China
Dr. Xiangdong Li, Chongqing Jinshan Science & Technology(Group) Co.,ltd, China
Prof. Yan Su, Nanjing University of Science & Technology, China
Prof. Yi Xu, Chongqing University, China
Dr. Keiichi Aoyagi,Executive director, Micromachine Center,Japan
Prof. Helmut Seidel, Saarland University, Germany
Mr. S.H.Shin, Samsung Advanced Inst. of Tech, Korea
Dr. Lerwen Liu, Zyvex, Singapore
Dr. Yang Zhao, President, MEMSIC, USA
Dr. Jiyun Feng, Nano and Advanced Materials Institute Limited, Hong Kong, China

Sponsorship

Organizers
China Instrument and Control Society (CIS)
National Development and Reform Commission of China (NDRC)
Ministry of Science and Technology of the People’s Republic of China
National Natural Science Foundation of China (NSFC)
Hi-Tech Research and Development Program of China (863 Program)

Host
MEMS & NEMS Society of China, CIS
Chongqing Jinshan Science & Technology(Group) Co.,ltd, China
Chongqing University, China
Chongqing University of Science & Technology(CQUST), China
China Electronics Technology Group Corporation (CETC), China

Sponsors
Chinese International NEMS Network (CINN)
Chongqing Economics Commission
Chongqing Science & Technology Commission
Silian Instrument Group Co. Ltd (SIC Group)

Supporters
Tsinghua University, China
Peking University, China
IMEC, Belgium
Northwestern Polytechnical University, China
Harbin Institute of Technology (HIT), China
Chinese University of Hong Kong
SEMI China
Microelectronics R&D Centre of the Chinese Academy of Sciences(MECCAS), China
Shanghai Institute of Microsystem and Information Technology (SIMIT),CAS, China
The British Embassy
The Canada Embassy
The Japan Embassy

About Co-Sponsors

1. The affiliation logo of Co-sponsor will be entered in the Sponsor Logo posted during the conference.
2. Participate in the conference organization, and determination
3. The Co-sponsor have the duty to invite participates, or make financial support.

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